DSAZSAA00020004.pdf by NXP Semiconductors
- Package outline TFBGA56: plastic thin fine-pitch ball grid array package; 56 balls; body 4 x 4.5 x 0.8 mm B D ball A1 index area SOT911-1 A A E A2 A1 detail X C e
- Original
- Unknown
- Unknown
- Unknown
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