DSAZSAA00020011.pdf by NXP Semiconductors
- Package outline HVQFN20: plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 4 x 4 x 0.85 mm A B D SOT917-3 terminal 1 index area A E A1 c
- Original
- Unknown
- Unknown
- Unknown
-
Powered by
Findchips
