DSAZSAA00020028.pdf by NXP Semiconductors

Partial File Text Package outline HLQFN56R: plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based; body 8 x 8 x 1.25 mm B D SOT935-1 A terminal 1 index area E
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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