DSAZSAA00020034.pdf by NXP Semiconductors

Partial File Text Package outline HUQFN88U: plastic thermal enhanced ultra thin quad flat package; no leads; 88 terminals; UTLP based; body 6 x 6 x 0.55 mm B D SOT942-1 A terminal 1 index area E A
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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