DSAZSAA00020057.pdf by NXP Semiconductors

Partial File Text Package outline HLQFN78R: plastic thermal enhanced low profile quad flat package; no leads; 78 terminals; resin based; body 12 x 12 x 1.15 mm B D SOT967-1 A terminal 1 index area E
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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