DSAZSAA00020066.pdf by NXP Semiconductors
- Package outline HXSON16U: plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; UTLP based; body 1.35 x 3.3 x 0.5 mm SOT985-1 X B D A E A A1 t
- Original
- Unknown
- Unknown
- Unknown
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