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    DSAZSAA00020069.pdf by NXP Semiconductors

    • Package outline VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4 x 4.5 x 0.65 mm Β ∆ SOT991-1 Α βαλλ Α1 ινδεξ αρεα Ε Α Α2 Î
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