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DSAZSAA00020069.pdf
by NXP Semiconductors
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Package outline VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4 x 4.5 x 0.65 mm Î â SOT991-1 Πβαλλ Î1 ινδεξ αÏεα Î Î Î2 Î
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