This site uses third-party website tracking technologies to provide and continually improve our services, and to display advertisements according to users' interests. I agree and may revoke or change my consent at any time with effect for the future.
Package outline
WLCSP12: wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm
A
E
NVT4555UK
B
A2
ball A1
index area
A
A1
D
detail X
e1
e
ZE2
C
Ãv