DSAZSAA00020091.pdf by NXP Semiconductors

Partial File Text Package outline WLCSP15: wafer-level chip-size package; 15 bumps; (4 x 4 - C2) D bump A1 index area A2 E A A1 detail X e1 e b D e C e2 B A 1 2 3 4 X Eur
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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