DSAZSAA00020094.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint WLCSP17: wafer level chip-size package; 17 bumps (6-5-6) D bump A1 index area A2 A E A1 detail X e 1/2 e b C e1 B1 B B2 B3 B
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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