DSAZSAA00020097.pdf by NXP Semiconductors

Partial File Text Package outline WLCSP39: wafer level chip-scale package; 39 balls; 2.66 x 3.765 x 0.38 mm B E NXH1501UK A ball A1 index area A A2 D A1 detail X e1 e3 e C C A B C
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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