DSAZSAA00020103.pdf by NXP Semiconductors

Partial File Text Package outline WLCSP9: wafer level chip-scale package; 9 bumps; body 1.36 x 1.36 x 0.51 mm (Backside Coating included) A E NX5P2090UK B ball A1 index area A2 A D A1 det
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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