DSAZSAA00020231.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of hermetically sealed glass surface-mounted package; 2 connectors SOD80C 4.55 4.30 2.30 2.25 1.70 1.60 0.90 (2x)
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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