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    DSAZSAA00020234.pdf by NXP Semiconductors

    • Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD323F 3.05 2.2 2.1 0.5 (2×) 1.65 0.95 0.6 (2×) 0.5 (2×) 0.
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