DSAZSAA00020267.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint 1.25 0.65 0.55 0.65 0.55 0.45 1.75 0.475 0.7 (2Ã) 0.6 (2Ã) solder resist solder paste = solderland occupied area Dimensions in mm 0.55 0.4 (2Ã)
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
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