DSAZSAA00020275.pdf by NXP Semiconductors

Partial File Text Package outline Footprint information for reflow soldering of HXSON16 package SOT1159-1 Hx Gx D 0.025 P 0.025 Ay Gy By SPy SPy tot SLy nSPy Hy nSPx SPx S
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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