DSAZSAA00020276.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of XQFN10 package SOT1160-1 1.95 1.7 CU 1.25 0.45 0.4 (6Ã) 0.22 CU (10Ã) 2.35 1 CU 0.85 2.1 CU 0.
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
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