DSAZSAA00020278.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of DFN2510-10 package SOT1165-1 Hx P C Hy Ay By 0.05 D D1 0.05 Generic footprint pattern Ref
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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