DSAZSAA00020286.pdf by NXP Semiconductors
- Reflow soldering footprint Footprint information for reflow soldering of HXSON4 package SOT1194-1 1.2 1.15 0.65 0.25 0.48 45° 1.55 0.5 1.2 1.3 0.025 0.48 r= 0.05
- Original
- Unknown
- Unknown
- Unknown
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