DSAZSAA00020297.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of DFN2520-9 package SOT1333-1 D1 (9x) C (8x) Ay solder land occupied area P1 DIMENSIONS in mm P1 Ay
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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