DSAZSAA00020299.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of XQFN10 package SOT1337-1 Hx Gx Fx P P 0.05 K 0.02 J D (10Ã) 0.05 0.02 C (6Ã) Hy Gy F
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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