DSAZSAA00020300.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of XFBGA24 package SOT1342-1 Hx ball A1 index area P P Hy see detail X Cu pad (CP) solder land (SL) so
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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