DSAZSAA00020477.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of TSOP36 package SOT851-2 Hx Gx P2 Hy (0.125) D1 Gy By Ay C X D2 (4x) P1 solder paste depos
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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