DSAZSAA00020479.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of HVQFN32 package SOT865-2 Hx Gx D P 0.025 0.025 C (0.105) SPx nSPx Hy SPy tot SPy Gy SL
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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