DSAZSAA00020481.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of QFN3333-8 package SOT873-1 2.35 2.25 0.635 0.75 0.617 0.05 (all around) 0.62 1.05 1.91 2.47 0.51
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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