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    DSAZSAA00020488.pdf by NXP Semiconductors

    • PC board footprint NXP Semiconductors Footprint for reflow soldering of HLQFN64 package SOT903-1 Hx D 1/2 P P C 0.065 Vd Vd1 Vx 0.12 SLy1 Hy By Vy3 Vy2
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