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DSAZSAA00020544.pdf
by NXP Semiconductors
Partial File Text
Thermal RC network (Foster) SPICE thermal model Symbol Parameter Rth(j-mb) BUK6213-30C Conditions thermal resistance from junction to mounting base 2.381E-05 F Cth6 5.803E-
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
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