DSAZSAA00020557.pdf by NXP Semiconductors

Partial File Text Thermal RC network (Foster) SPICE thermal model Symbol Parameter Rth(j-mb) BUK6E3R2-55C Conditions thermal resistance from junction to mounting base 2.617E-04 F Cth6 6.690E
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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