The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSASW00343901.pdf
Partial File Text
USER'S MANUAL (Chip Scale Package) ยท To make a win-win situation for CSP products supplier and customer, Samsung provides the information of CSP package's characteristics and manuals to maintai
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
DSASW00343901.pdf
preview
Download Datasheet
User Tagged Keywords
1mm pitch BGA socket
air handling unit
CRACK
FBGA 8 x 14 package tray
fbga Substrate design guidelines
handling damage
HCFC141B
LGA socket
MANUAL PCB
pcb substrate
Samsung MCP
Samsung pick up
samsung reflow profile