DSA0072912.pdf by Enpirion

Partial File Text Enpirion, Inc. EN53x0D AN103_R0.9 Soldering Module Packages Having Large Asymmetric Pads 1.0 INTRODUCTION Enpirion's power converter packages utilize module package technology to form Land Gr
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AN103 an103r Enpirion lga components LGA land pattern LGA PACKAGE thermal resistance paste profile reflow profile FOR LGA COMPONENTS solder joint stencil