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DSA0072994.pdf
by Enpirion
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Enpirion, Inc. EN5311QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion's EN5311QI power converter packages are designed with a plastic leadframe package technology that utilizes copp
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"exposed pad" PCB via
EN5311
EN5311Qi
IPC-7095
IPC-7095B
QFN PACKAGE thermal resistance
qfn stencil