DSA00208162.pdf by Xilinx

Partial File Text R Chapter 4: PCB Design Considerations Package Specifications This section contains specifications for the following Virtex-II packages: · · "FG256 Fine-Pitch BGA Package (1.00 mm Pitch)
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BF957 BG728 BGA Package CS144 FF1152 FG256 FG676 led flip-chip UG002

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