DSA0055826.pdf by Amphenol

Partial File Text Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch(0.38 micron) min gold plating at matig
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DSA0055826.pdf preview

Download Datasheet

User Tagged Keywords

CAD-0605-122 CAD0605122

Price & Stock Powered by