DSA2IH0016018.pdf by Not Available

Partial File Text Military PAL Devices MMI PACKAGE DESIGNATOR J/JS W L PACKAGE TYPE CERAMIC DIP CERAMIC FLATPACK CERAMIC LEADLESS CHIP CARRIER STANDARD LEAD FINISH SOLDER DIP SOLDER DIP SOLDER DIP MIL-SPEC
Datasheet Type Scan
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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MONOLITHIC MEMORIES