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    DSAE0068126.pdf by Atmel

    • Packages Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types.(1)
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    DSAE0068126.pdf preview
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    0502a 28-P3 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 J-Lead, plcc MIL-STD-1835 MO-047 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC PQFP chip size quad flat j-leaded package soic 16 Jedec package outline soic 20 Jedec package outline soic 20 lead wide
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