DSA2IH00164534.pdf by Not Available

Partial File Text PACKAGE INFORMATION BUMP CHIP FEATURES PAD PITCH: UNDER 69jmi · Bump SPEC -- Bump Type: Straight Wall Type -- Bump Material: Au (Gold) -- Bump Height: 14pm ± 3nm · Bump Hardness: Below 50Hv · Bum
Datasheet Type Scan
RoHS Unknown
Pb Free Unknown
Lifecycle Obsolete

DSA2IH00164534.pdf preview Download Datasheet