DSA0022141.pdf by Texas Instruments

Partial File Text PowerPAD Thermally Enhanced Package TECHNICAL BRIEF: SLMA002 Mixed Signal Products Semiconductor Group 21 November 1997 IMPORTANT NOTICE Texas Instruments (TI) reserves the right to make c
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"x-ray machine" cut template DRAWING double sided pcb, thermal via land pattern for tSOP56 SLMA002 SLMA002 LAND PATTERN TQFP100 TQFP64 TQFP64 land package tsop20 TSOP24 TSOP56

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