A multi-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation. Use thermal interface material (TIM) and a heat sink if possible.
Use a shielded enclosure, keep signal traces short, and use a common-mode choke or ferrite bead on the input lines. Ensure the device is properly decoupled and use a low-pass filter if necessary.
Operating beyond the recommended temperature range can lead to reduced performance, increased power consumption, and potentially permanent damage to the device. Ensure proper thermal management and avoid extreme temperatures.
Use a logic analyzer or oscilloscope to monitor signals and identify issues. Check the device's power supply, clock signals, and input/output connections. Consult the datasheet and application notes for troubleshooting guidelines.
The device's reliability and lifespan depend on factors like operating temperature, power supply quality, and environmental conditions. Consult the datasheet and Texas Instruments' reliability reports for more information.