Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as keeping the signal traces short, using a solid ground plane, and minimizing noise coupling. Additionally, consider using a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
To ensure reliable operation, follow the recommended operating conditions, including voltage and current ratings. Also, consider the thermal management of the device, using heat sinks or thermal pads if necessary. Make sure to characterize the device's performance over the entire operating temperature range during the design and testing phase.
The POR circuitry ensures that the device resets properly during power-up. However, it may affect the device's behavior during power-on, such as delaying the start-up time. Consider the POR timing and voltage thresholds when designing your power-up sequence and reset logic.
The BIST feature is used to test the device's internal functions during manufacturing. In your design, you may need to disable the BIST feature or ensure that it doesn't interfere with your application's normal operation. Consult the datasheet and application notes for specific guidance on handling BIST.
To minimize EMI and ensure EMC, follow good design practices, such as using shielding, filtering, and proper grounding. Also, consider the device's radiation patterns and susceptibility to external interference. Consult the datasheet and relevant standards (e.g., CISPR, FCC) for specific guidance.
5962-9564701QXA datasheet
by Texas Instruments
