Texas Instruments recommends a thermal pad on the bottom of the package, connected to a solid copper plane on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the thermal plane.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (-40°C to 125°C) and consider the device's power dissipation and thermal resistance. Additionally, ensure proper thermal design, including heat sinking and airflow, to maintain a safe junction temperature.
The datasheet recommends using X5R or X7R ceramic capacitors with a minimum capacitance of 10uF for input and output filtering. The capacitors should be placed as close as possible to the device's pins to minimize parasitic inductance and ensure proper filtering.
To troubleshoot output voltage sag or oscillation, check the input voltage, output load, and PCB layout for any issues. Ensure the input voltage is within the recommended range, and the output load is within the device's current rating. Also, verify that the PCB layout follows the recommended guidelines for thermal performance and noise reduction.
To minimize EMI and noise, follow proper PCB layout guidelines, including separating analog and digital grounds, using a solid ground plane, and placing bypass capacitors close to the device's pins. Additionally, consider using shielding or a metal can to reduce radiated emissions.
Findchips
Findchips