DSA3H002097.pdf by Xilinx

Partial File Text 100% Material Declaration Data Sheet FFG484 PK403 (v1.3) September 28, 2012 Average Weight: 4.0582g Component Silicon Die (FPGA) Solder Bump Tin Lead Die Underfill Bisphenol F-type liquid epoxy r
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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