DSA3H002108.pdf by Xilinx

Partial File Text PK473 (v1.1) September 28, 2012 100% Material Declaration Data Sheet FF1760 Virtex-6 Average Weight: 21.0187 g Component Silicon Die (FPGA) Solder Bump Tin (Sn) Lead (Pb) Die Underfill Bispheno
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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