DSA00299950.pdf by Central Semiconductor

Partial File Text PROCESS CP608 Power Transistor PNP - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL BASE Die Size 66 X 66 MILS Die Thickness 12.5 ± 1.0 MILS Base Bonding
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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CJD32C CP608 TIP32C

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