DSA00299951.pdf by Central Semiconductor

Partial File Text PROCESS CP611 Power Transistor PNP - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL BASE Die Size 80 X 99 MILS Die Thickness 12.5 ± 1 MILS Base Bonding Pad
Datasheet Type Original
RoHS No
Pb Free No
Lifecycle Obsolete
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CJD42CBK

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chip die transistor CJD42C CP611 TIP42C transistor CR pnp Transistor switch