DSA0026741.pdf by Intersil

Partial File Text Thermal Characterization and Board Level Modeling of the RSLIC18 in the MLFP Package TM Application Note October 2001 AN9922 Author: Doug Bruss Introduction In most circuit designs r
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an9922 JESD51-3 JESD51-5 JESD51-7 mlf 0.3mm pitch MO220 TB379