DSA00299964.pdf by Central Semiconductor

Partial File Text PROCESS CPD04 General Purpose Rectifier 500 mA Glass Passivated Rectifier Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 25 x 25 MILS Die Thickness 9.5 MILS A
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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1N645 1N649 CBRHD-02 CPD04

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