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DSA00299978.pdf
by Central Semiconductor
Partial File Text
PROCESS CPD80V Switching Diode High Voltage Switching Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 16 x 16 MILS Die Thickness 7.1 MILS Anode Bonding Pad Ar
Datasheet Type
Original
RoHS
No
Pb Free
No
Lifecycle
Obsolete
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CMLD2004TR
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1N3070
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