DSAE0072925.pdf by Intel

Partial File Text CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT (Surface Mount T
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSAE0072925.pdf preview

Download Datasheet

User Tagged Keywords

28F010 80486 DX4 80C196KB 80c196kb 1988 82425EX DRS-21 intel 80486 IPC-SM-786 land pattern for TSOP land pattern for TSOP 2 pace craft 100 paste profile pcb warpage* in smt reflow PQFP moisture sensitive handling and packaging QFP PACKAGE thermal resistance reflow profile TSOP infrared