DSAZIHA1000298205.pdf by Microsemi

Partial File Text GaAs Schottky Devices Low RS Flip Chip Â® TM MS8150 - P2613 Dimensions Size: 26 x 13 mils Thickness: 5 mils Bond Pad Size: 5 x 8 mils Features â Capacitance (65 fF Typ.) â
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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