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    DSA0092613.pdf by Avago Technologies

    • HMMC-3002 DC ­ 16 GHz GaAs HBT MMIC Divide-by-2 Prescaler Data Sheet Chip Size: Chip Size Tolerance: Chip Thickness: Pad Dimensions: 1330 x 440 µm (52.4 x 17.3 mils) ± 10 µm (± 0.4 mils) 127
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